Dimension 156.75mm x 156.75mm ± 0.25mm
Diagonal 210mm ± 0.25mm (round chamfers)
Thickness(Si) 190+20/-30µm
Front Anisotropically texturized surface and dark silicon nitride anti-reflection coatings 0.8±0.1mm silver busbars
Back Local aluminum back-surface field 1.4±0.1mm (sliver/aluminum) discontinuous soldering pads
► Features
˃ High conversion efficiencies resulting in superior power output performance
˃ Outstanding power output even in low light or high temperature conditions
˃ Optimized design for ease of soldering and lamination
˃ Long-term stability, reliability and performance
˃ Low breakage rate
˃ Uniform Color
► Production and Quality Control
˃ Precision cell efficiency sorting procedures
˃ Stringent criteria for color uniformity and appearance
˃ Reverse current and shunt resistance screening
˃ ISO9001,ISO14001 and OHSAS 18001 certificated
˃ Calibrated against Fraunhofer ISE
Email us if you are interested in ts communication fiber optic products and solutions. We would be happy to answer your questions.