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M156BB5

Introduction:

Dimension 156.75mm x 156.75mm ± 0.25mm
Diagonal 210mm ± 0.25mm (round chamfers)
Thickness(Si) 180+20/-30µm
Front Anisotropically texturized surface and dark silicon nitride anti-reflection coatings 0.8±0.1mm silver busbars
Back Local aluminum back-surface field 1.4±0.1mm (sliver/aluminum) discontinuous soldering pads


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Product details

► Features

˃ High conversion efficiencies resulting in superior power output performance

˃ Outstanding power output even in low light or high temperature conditions

˃ Optimized design for ease of soldering and lamination

˃ Long-term stability, reliability and performance

˃ Low breakage rate

˃ Uniform Color


► Production and Quality Control

˃ Precision cell efficiency sorting procedures

˃ Stringent criteria for color uniformity and appearance

˃ Reverse current and shunt resistance screening

˃ ISO9001,ISO14001 and OHSAS 18001 certificated

˃ Calibrated against Fraunhofer ISE


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